Study on the film-forming process of high-viscosity adhesive droplets by extrusion

XU Zheng; HE Wenxin; CUI Leijie; WANG Xiaodong; LU Shiqin

doi:10.37188/OPE.20233120.2986

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Study on the film-forming process of high-viscosity adhesive droplets by extrusion

Micro/Nano Technology and Fine Mechanics | 更新时间：2023-11-27

- Study on the film-forming process of high-viscosity adhesive droplets by extrusion
- Optics and Precision Engineering Vol. 31, Issue 20, Pages: 2986-2992(2023)
- 作者机构：
  
  1.大连理工大学机械工程学院，辽宁大连 116085
- 作者简介：
- 基金信息：
- DOI：10.37188/OPE.20233120.2986
  CLC：
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徐征,何文鑫,崔镭杰等.微量高黏液态胶的挤压成膜研究[J].光学精密工程,2023,31(20):2986-2992.

XU Zheng,HE Wenxin,CUI Leijie,et al.Study on the film-forming process of high-viscosity adhesive droplets by extrusion[J].Optics and Precision Engineering,2023,31(20):2986-2992.
徐征,何文鑫,崔镭杰等.微量高黏液态胶的挤压成膜研究[J].光学精密工程,2023,31(20):2986-2992. DOI： 10.37188/OPE.20233120.2986.

XU Zheng,HE Wenxin,CUI Leijie,et al.Study on the film-forming process of high-viscosity adhesive droplets by extrusion[J].Optics and Precision Engineering,2023,31(20):2986-2992. DOI： 10.37188/OPE.20233120.2986.

摘要

微胶连中胶膜厚度和填充度对粘接强度和连接蠕变影响显著，为此，本文研究了微量高黏液态胶挤压成膜的工艺过程：选择典型微小圆片组为胶连对象，建立了描述微胶连流动的计算仿真模型和描述填充度的占空比指标，根据计算结果初步确定了分配胶量和胶滴数量等工艺参数，研制了精密微胶连装配设备，选择环氧树脂胶为样品进行微胶连实验和分析。研究结果表明：在本文实验条件下，挤压成膜的胶液占空比随着胶滴数的增加而增加，但最终趋向稳定在~91.8%；此外，挤压成形的胶膜厚度与挤压力呈近似线性关系，并且这一关系受胶滴数影响较小，当挤压力达到7.92 N，成膜厚度~25 μm。研究对提高微胶连工艺可控性和胶膜质量有借鉴意义。

Abstract

During adhesive microbonding， both the adhesive thickness and the filling status can significantly affect the bond strength and creeping. In this study， the film-forming process by extrusion using a high-viscosity adhesive was examined. A typical group of tiny round parts is selected for adhesive microbonding. The simulation model describing the adhesive microbonding and the ratio of space occupancy by the adhesive， which represents the filling status， was established. The process parameters were initially determined based on the evaluated results， such as the amount of adhesive droplets. A precision adhesive microbonding assembly device was developed， and an epoxy resin adhesive was selected as the sample for adhesive microbonding experiments and analysis. Under suitable experimental conditions， the ratio of space occupancy by the adhesive increased with increasing amount of adhesive droplets， but tended to stabilize at 91.8%. In addition， adhesive thickness had an approximately linear relationship with extrusion force， and this relationship was less affected by the amount of adhesive droplets. An adhesive thickness of 25 μm was achieved as the extrusion force reached 7.92 N. The results of this study will help improve the existing adhesive microbonding process.

关键词

微装配微胶连高黏胶液胶膜厚度

Keywords

micro assemblyadhesive microbondinghigh-viscosity liquidadhesive thickness

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