1.大连理工大学 机械工程学院,辽宁 大连 116085
[ "徐 征(1973-),男,河南郑州人,博士,副研究员,1997年和2000年于吉林工业大学分别获得学士和硕士学位,2004年于大连理工大学获得博士学位,主要从事微纳集成制造的研究。E-mail: xuzheng@dlut.edu.cn" ]
[ "王晓东(1967-),男,黑龙江哈尔滨人,教授,博士生导师,1989年于南京航空学院获得学士学位,1992年于哈尔滨船舶工程学院获得硕士学位,1995年于哈尔滨工业大学获得博士学位。主要从事微装配技术与系统、精密仪器设计与制造等方面的研究。 E-mail: xdwang@dlut.edu.cn" ]
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徐征,何文鑫,崔镭杰等.微量高黏液态胶的挤压成膜研究[J].光学精密工程,2023,31(20):2986-2992.
XU Zheng,HE Wenxin,CUI Leijie,et al.Study on the film-forming process of high-viscosity adhesive droplets by extrusion[J].Optics and Precision Engineering,2023,31(20):2986-2992.
徐征,何文鑫,崔镭杰等.微量高黏液态胶的挤压成膜研究[J].光学精密工程,2023,31(20):2986-2992. DOI: 10.37188/OPE.20233120.2986.
XU Zheng,HE Wenxin,CUI Leijie,et al.Study on the film-forming process of high-viscosity adhesive droplets by extrusion[J].Optics and Precision Engineering,2023,31(20):2986-2992. DOI: 10.37188/OPE.20233120.2986.
微胶连中胶膜厚度和填充度对粘接强度和连接蠕变影响显著,为此,本文研究了微量高黏液态胶挤压成膜的工艺过程:选择典型微小圆片组为胶连对象,建立了描述微胶连流动的计算仿真模型和描述填充度的占空比指标,根据计算结果初步确定了分配胶量和胶滴数量等工艺参数,研制了精密微胶连装配设备,选择环氧树脂胶为样品进行微胶连实验和分析。研究结果表明:在本文实验条件下,挤压成膜的胶液占空比随着胶滴数的增加而增加,但最终趋向稳定在~91.8%;此外,挤压成形的胶膜厚度与挤压力呈近似线性关系,并且这一关系受胶滴数影响较小,当挤压力达到7.92 N,成膜厚度~25 μm。研究对提高微胶连工艺可控性和胶膜质量有借鉴意义。
During adhesive microbonding, both the adhesive thickness and the filling status can significantly affect the bond strength and creeping. In this study, the film-forming process by extrusion using a high-viscosity adhesive was examined. A typical group of tiny round parts is selected for adhesive microbonding. The simulation model describing the adhesive microbonding and the ratio of space occupancy by the adhesive, which represents the filling status, was established. The process parameters were initially determined based on the evaluated results, such as the amount of adhesive droplets. A precision adhesive microbonding assembly device was developed, and an epoxy resin adhesive was selected as the sample for adhesive microbonding experiments and analysis. Under suitable experimental conditions, the ratio of space occupancy by the adhesive increased with increasing amount of adhesive droplets, but tended to stabilize at 91.8%. In addition, adhesive thickness had an approximately linear relationship with extrusion force, and this relationship was less affected by the amount of adhesive droplets. An adhesive thickness of 25 μm was achieved as the extrusion force reached 7.92 N. The results of this study will help improve the existing adhesive microbonding process.
微装配微胶连高黏胶液胶膜厚度
micro assemblyadhesive microbondinghigh-viscosity liquidadhesive thickness
TOFIL S, DANIELEWSKI H, WITKOWSKI G, et al. Technology and properties of peripheral laser-welded micro-joints[J]. Materials, 2021, 14(12): 3213. doi: 10.3390/ma14123213http://dx.doi.org/10.3390/ma14123213
XIE B, LIU H C, HU R, et al. White-light-emitting diodes: targeting cooling for quantum dots in white QDs-LEDs by hexagonal boron nitride platelets with electrostatic bonding[J]. Advanced Functional Materials, 2018, 28(30): 1801407. doi: 10.1002/adfm.201870212http://dx.doi.org/10.1002/adfm.201870212
姚竹贤, 胡建忠, 张之敬. 陀螺仪装配结构稳定性控制技术[J]. 机械工程学报, 2018, 54(9): 145-152. doi: 10.3901/jme.2018.09.145http://dx.doi.org/10.3901/jme.2018.09.145
YAO Z X, HU J Z, ZHANG Z J. Assembly technology of structure stability control for high precision gyroscope[J]. Journal of Mechanical Engineering, 2018, 54(9): 145-152.(in Chinese). doi: 10.3901/jme.2018.09.145http://dx.doi.org/10.3901/jme.2018.09.145
PENG P, ZHOU W, YU H J, et al. Investigation of the thermal drift of MEMS capacitive accelerometers induced by the overflow of Die attachment adhesive[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(5): 822-830. doi: 10.1109/tcpmt.2016.2521934http://dx.doi.org/10.1109/tcpmt.2016.2521934
郭磊, 刘检华, 张佳朋, 等. 航天工业中胶接技术的研究现状分析[J]. 中国机械工程, 2021, 32(12): 1395-1405. doi: 10.3969/j.issn.1004-132X.2021.12.002http://dx.doi.org/10.3969/j.issn.1004-132X.2021.12.002
GUO L, LIU J H, ZHANG J P, et al. Research status analysis of adhesively connection technology in aerospace industry[J]. China Mechanical Engineering, 2021, 32(12): 1395-1405. (in Chinese). doi: 10.3969/j.issn.1004-132X.2021.12.002http://dx.doi.org/10.3969/j.issn.1004-132X.2021.12.002
赵云峰. 航天特种高分子材料研究与应用进展[J]. 中国材料进展, 2013, 32(4): 217-228, 242. doi: 10.7502/j.issn.1674-3962.2013.04.04http://dx.doi.org/10.7502/j.issn.1674-3962.2013.04.04
ZHAO Y F. Progress on research and application of special polymer materials in aerospace industry[J]. Materials China, 2013, 32(4): 217-228, 242.(in Chinese). doi: 10.7502/j.issn.1674-3962.2013.04.04http://dx.doi.org/10.7502/j.issn.1674-3962.2013.04.04
COGNARD JY, CRÉAC’HCADEC R, SOHIER L, et al. Influence of adhesive thickness on the behaviour of bonded assemblies under shear loadings using a modified TAST fixture[J]. International Journal of Adhesion and Adhesives, 2010, 30(5): 257-266. doi: 10.1016/j.ijadhadh.2009.11.003http://dx.doi.org/10.1016/j.ijadhadh.2009.11.003
SILVA LFDA, CARBAS RJ, CRITCHLOW GW, et al. Effect of material, geometry, surface treatment and environment on the shear strength of single lap joints[J]. International Journal of Adhesion and Adhesives, 2009, 29(6): 621-632. doi: 10.1016/j.ijadhadh.2009.02.012http://dx.doi.org/10.1016/j.ijadhadh.2009.02.012
NAITO K, ONTA M, KOGO Y. The effect of adhesive thickness on tensile and shear strength of polyimide adhesive[J]. International Journal of Adhesion and Adhesives, 2012, 36: 77-85. doi: 10.1016/j.ijadhadh.2012.03.007http://dx.doi.org/10.1016/j.ijadhadh.2012.03.007
贾树强, 黄玮, 庞武斌. 胶层厚度对三点支撑反射镜面形的影响[J]. 光学 精密工程, 2015, 23(7): 2005-2012. doi: 10.3788/ope.20152307.2005http://dx.doi.org/10.3788/ope.20152307.2005
JIA S Q, HUANG W, PANG W B. Influence of adhesive thickness on surface deformation of mirror supported by three-point mount[J]. Opt. Precision Eng., 2015, 23(7): 2005-2012.(in Chinese). doi: 10.3788/ope.20152307.2005http://dx.doi.org/10.3788/ope.20152307.2005
ROŚKOWICZ M, GODZIMIRSKI J, KOMOREK A, et al. The effect of adhesive layer thickness on joint static strength[J]. Materials, 2021, 14(6): 1499. doi: 10.3390/ma14061499http://dx.doi.org/10.3390/ma14061499
YANG L Y, KING C K, BERNSTEIN J B. Liquid dispensing encapsulation in semiconductor packaging[J]. Microelectronics International, 2003, 20(3): 29-35. doi: 10.1108/13565360310487927http://dx.doi.org/10.1108/13565360310487927
刘强, 何欣, 张峰, 等. 反射镜无热装配中胶层厚度的计算及控制[J]. 光学 精密工程, 2012, 20(10): 2229-2236. doi: 10.3788/ope.20122010.2229http://dx.doi.org/10.3788/ope.20122010.2229
LIU Q, HE X, ZHANG F, et al. Calculation and control of adhesive layer in reflector athermal mount[J]. Opt. Precision Eng., 2012, 20(10): 2229-2236.(in Chinese). doi: 10.3788/ope.20122010.2229http://dx.doi.org/10.3788/ope.20122010.2229
YANG X W, ZHANG D H, WU B Y, et al. Accurate characterization of the adhesive layer thickness of ceramic bonding structures using terahertz time-domain spectroscopy[J]. Materials, 2022, 15(19): 6972. doi: 10.3390/ma15196972http://dx.doi.org/10.3390/ma15196972
解孟涛, 刘俊标, 王鹏飞, 等. 离心法曲面涂胶的胶层厚度研究[J]. 光学 精密工程, 2022, 30(1): 71-77. doi: 10.37188/OPE.2021.0477http://dx.doi.org/10.37188/OPE.2021.0477
XIE M T, LIU J B, WANG P F, et al. Research on resist-layer thickness by spin-coating on curved substrate[J]. Opt. Precision Eng., 2022, 30(1): 71-77. (in Chinese). doi: 10.37188/OPE.2021.0477http://dx.doi.org/10.37188/OPE.2021.0477
ZHU P, XU Z, XU X Y, et al. Squeezing dynamic mechanism of high-viscosity droplet and its application for adhesive dispensing in sub-nanoliter resolution[J]. Micromachines, 2019, 10(11): 728. doi: 10.3390/mi10110728http://dx.doi.org/10.3390/mi10110728
LIU H F, QIAO K Q, SUN X W, et al. Surface tension-based ultra-micro precision dispensing method for micro-scale manufacturing and its key influence factors analysis[J]. Journal of Micromechanics and Microengineering, 2020, 30(12): 125005. doi: 10.1088/1361-6439/abbb7chttp://dx.doi.org/10.1088/1361-6439/abbb7c
BROBOANA D, IONESCU C S, BALAN C. The fracture of yield stress fluid jet in air and in viscous fluids[J]. IOP Conference Series: Earth and Environmental Science, 2021, 664(1): 012003. doi: 10.1088/1755-1315/664/1/012003http://dx.doi.org/10.1088/1755-1315/664/1/012003
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