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Bump height measurement of chip packaging based on white light triangulation
Modern Applied Optics | Updated：2026-09-12
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    • Bump height measurement of chip packaging based on white light triangulation

    • LIN Xianjin , WU Zuwei , YE Ruiqian , WANG Lei
    • Optics and Precision Engineering Vol. 31, Issue 13, Pages: 1890-1899(2023)

    • DOI： 10.37188/OPE.20233113.1890     

      CLC：

    • Revised：2022-12-21 ，

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